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T-SPL
Thermal Scanning Probe Lithography
OPTICAL-LITHO
Optical-Lithography
EBL
Electron Beam Lithography
FIB
Focused Ion Beam
WE
Wet Etching
RIE
Reactive Ion Etching
DEEP-RIE
Deep Reactive Ion Etching
ALD
Atomic Layer Deposition
CVD
Chemical Vapour Deposition
CBD
Cluster Beam Deposition
MBE
Molecular Beam Epitaxy
PLD
Pulsed Laser Deposition
PVDS
PVD sputtering
OMBD
Organic Molecular Beam Deposition
PES
Photo-Electron Spectroscopy
ARPES
Angle Resolved Photoelectron Spectroscopy
EIC
Electron-Ion-Coincidence
MAGNETOMETRY
Magnetometry
MOKE
Magneto-Optic Kerr Effect
MT
Magneto-Transport
US
Ultrafast-Spectroscopy
XMCD
X-ray Magnetic Circular/Linear Dichroism
XAS
X-ray Absorption Spectroscopy
CL
Cathodoluminescence
Optical-luminesc
Optical-luminescence
RS
RAMAN
TEM/STEM
Cold FEG TEM/STEM Jeol JEM F200
SEM
Scanning Electron Microscopy
LEEM
Low Energy Electron Microscopy
FIB-SEM
FIB-SEM for 3D reconstruction and TEM lamellae preparation
X-PEEM
X- ray Photo-Emitted Electron Microscopy
XRD
X-Ray Diffraction
SPA-LEED
LOW ENERGY ELECTRON DIFFRACTION
AFM
Atomic Force Microscopy
STM
Scanning Tunneling Microscopy
SFEM
Scanning Field Emission Microscopy
MS
Mass Spectrometry
IR
Infra-red Spectroscopy
TP
TRANSPORT PROPERTIES
AMM
ATOMS AND MOLECULES IN MOTION
ESP
EXCITED-STATE PROPERTIES
MP
MAGNETIC PROPERTIES
SGSEP
Structural and ground-state electronic properties
MULTI-SCALE
MULTI-SCALE PROCESS SIMULATION FROM THE MACRO TO THE ATOMIC SCALE
RF-VNA
RF VNA characterization with probe station
SRP
SPREADING RESISTANCE PROFILING
LA-Optical Litho
Large Area Optical Litography
LA-CVD
Large Area Chemical Vapor Deposition
LA-ALD
Large Area ATOMIC LAYER DEPOSITION
LA-DWL
Large Area Direct write lithography
LA-RIE
Large Area Reactive Ion Etching
TOF
Time Of Flight
CELIV
Charge Extraction by Linearly Increasing Voltage
Ellipsometry
XRR
X-Ray Reflectivity
LA-XRD
Large Area X-Ray Diffraction
DS
Dicing-saw
Deposition
Electrochemical deposition
Bonder
Wafer Bonder