Deep Reactive Ion Etching

Deep Reactive Ion Etching (Deep-RIE) is a crucial microfabrication technique for creating high-aspect-ratio structures. It involves alternating isotropic and anisotropic etching steps using different gas chemistries. DRIE enables precise control over etch depth and profile, making it essential for MEMS, microfluidics, and optical components. Deep-RIE provides high density plasma without having to increase the DC bias. Radio Frequency (RF) biasing can be used independently to increase or decrease the energy of the ions impinging on the specimen surface. DEEP-RIE can achieve high etch rates by high ion or radical densities, while high material selectivity and low surface damage is achieved by using low ion energies. High density plasma can operate at low pressures and can yield significantly improved profile control for very deep, anisotropic etches.